A division of 1030 Evans Ave. Akron, OH 44305 Tel: 330.630.9460 Fax: 330.630.2857 Compound Terminology 1. No Post Cure Base or Compound: reaches an optimum balance of properties after curing in a press or in an extrusion process. Generally has better compression set characteristics but somewhat lower tensile and tear properties than a general purpose compound. A post cure to remove catalyst by-products may be required for articles used in repeated contact with food. 2. General Purpose Compound or Base: generally requires a post cure to reach an optimum balance of properties after curing. 3. High Strength Compound or Base: has a tear strength( Die B) of greater than 150 ppi. Tensile strength, flex resistance and abrasion resistance of this class of material is generally better than that of other classes, while heat resistance is somewhat lower. 4. Low Temperature Compound: one with a low temperature brittle point in the range of -116°C (-178°F) compared to a low temperature brittle point of -73°C (-100°F) for general purpose silicones. 5. Wire and Cable Compound:specifically compounded for applications such as motor lead wire and automotive ignition cable jacketing. Most of the products in this class have high volume resistivities (³ 1015W-cm) and/ or dielectric strengths. Some have extremely good heat resistance with ULâ ratings for long term service at 210 - 260°C. 6. Electrically Conductive Compound: characterized by volume resistivities in the range of 3x10-3 to 106 W-cm. 7. Addition Cured Compound or Base: uses a platinum cure system instead of a peroxide system. Characterized by exceptionally high tear strength and tight surface cure. Often used in applications where peroxide catalyst by-products are objectionable. 8. Specialty Elastomers: includes products such as self-lubricating compounds, thermally conductive compounds which do not fit into the above categories. 9. Fluorosilicone Compound or Base: based on a fluorine containing polymer giving the material excellent resistance to many fuels and chemicals which would severely degrade silicone and most other polymers. Has low temperature characteristics similar to that of general purpose silicones compounds. 10. LIMS (Liquid Injection Molding Systems): two part platinum cured systems designed specifically for injection molding. These materials are supplied in pails or drums. 11. Gum: the basic polymer used to make bases and compounds. 12. Additives and Modifiers: materials which may be added to bases or compounds to improve characteristics such as heat stability and flame retardancy. 13. Primers: adhesive systems designed to bond specific types of compounds or bases to various substrates. quality goal | sales representation | facilities products | contact us Hosted by The MIS Group at Shin-Etsu and Shincor Silicones , Inc. Best viewed with Internet Explorer and 800 x 600 resolution